Samsung starts mass production of DRAM/NAND memory moduleSamsung has begun mass producing its latest smartphone memory – the LPDDR5 UFS-based multichip package (uMCP).

Samsung’s uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash.

“As 5G-compatible devices become more mainstream, we anticipate that our latest multichip package innovation will accelerate the market transition to 5G,” says Samsung vp Young-soo Sogn,

Compared to previous LPDDR4X-based UFS 2.2, DRAM performance has been increased from 17 gigabytes per second (GB/s) to 25GB/s, and NAND performance has been increased  from 1.5GB/s to 3GB/s.

The new uMCP also helps to maximize space efficiency within a smartphone by integrating DRAM and NAND storage into a single compact package that measures only 11.5mm x 13mm, allowing more space for other features.

With DRAM capacities ranging from 6 gigabytes (GB) to 12GB and storage options from 128GB to 512GB, the Samsung uMCP can be easily customized to accommodate the diverse needs of 5G smartphones throughout the mid- and high-end segments.

Samsung has completed compatibility testing of the LPDDR5 uMCP with several global smartphone manufacturers, and expects its uMCP-equipped devices to hit mainstream markets starting this month.